University of Illinois Urbana-Champaign

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Thumbnail for Characterization Of Low Temperature Creep Properties Of Crack Sealants Using Bending Beam Rehometry
Characterization Of Low Temperature Creep Properties Of Crack Sealants Using Bending Beam Rehometry
Al-Qadi, Imad L.; Yang, Shih-Hsien; Elseifi, Mostafa; Dessouky, Samer; Loulizi, Amara; Masson, Jean-François; McGhee, Kevin K.