University of Illinois Urbana-Champaign

Multiphysics modeling and simulation for large-scale integrated circuits

Lu, Tianjian

Content Files
LU-DISSERTATION-2016.pdf

Permalink

https://hdl.handle.net/2142/95323

Description

Title
Multiphysics modeling and simulation for large-scale integrated circuits
Author(s)
Lu, Tianjian
Issue Date
2016-11-21
Director of Research (if dissertation) or Advisor (if thesis)
Jin, Jianming
Doctoral Committee Chair(s)
Jin, Jianming
Committee Member(s)
  • Schutt-Ainé, José E.
  • Godddard, Lynford L.
  • Geubelle, Philippe H.
Department of Study
Electrical & Computer Eng
Discipline
Electrical & Computer Engr
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Date of Ingest
2017-03-01T15:48:49Z
Keyword(s)
  • Multiphysics
  • Integrated circuits
  • Electromagnetics
  • Heat transfer
  • Conjugate heat transfer
  • Thermal stress
  • Electrical-thermal
  • Microchannel cooling
  • Coupled electrical-thermal-mechanical
  • Finite element method
  • Domain decomposition
  • Parallel computing
Abstract
This dissertation is a process of seeking solutions to two important and challenging problems related to the design of modern integrated circuits (ICs): the ever increasing couplings among the multiphysics and the large problem size arising from the escalating complexity of the designs. A multiphysics-based computer-aided design methodology is proposed and realized to address multiple aspects of a design simultaneously, which include electromagnetics, heat transfer, fluid dynamics, and structure mechanics. The multiphysics simulation is based on the finite element method for its unmatched capabilities in handling complicate geometries and material properties. The capability of the multiphysics simulation is demonstrated through its applications in a variety of important problems, including the static and dynamic IR-drop analyses of power distribution networks, the thermal-ware high-frequency characterization of through-silicon-via structures, the full-wave electromagnetic analysis of high-power RF/microwave circuits, the modeling and analysis of three-dimensional ICs with integrated microchannel cooling, the characterization of micro- and nanoscale electrical-mechanical systems, and the modeling of decoupling capacitor derating in the power integrity simulations. To perform the large-scale analysis in a highly efficient manner, a domain decomposition scheme, parallel computing, and an adaptive time-stepping scheme are incorporated into the proposed multiphysics simulation. Significant reduction in computation time is achieved through the two numerical schemes and the parallel computing with multiple processors.
Graduation Semester
2016-12
Type of Resource
text
Permalink
http://hdl.handle.net/2142/95323
Copyright and License Information
Copyright 2016 Tianjian Lu

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Dissertations and Theses - Electrical and Computer Engineering
Dissertations and Theses in Electrical and Computer Engineering
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Graduate Theses and Dissertations at Illinois