Printed microscale mono-crystalline silicon on flexible substrates for photovoltaic, strain sensors, and neural interface applications
Yu, Ki Jun
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https://hdl.handle.net/2142/89203
Description
Title
Printed microscale mono-crystalline silicon on flexible substrates for photovoltaic, strain sensors, and neural interface applications
Author(s)
Yu, Ki Jun
Issue Date
2015-11-18
Director of Research (if dissertation) or Advisor (if thesis)
Rogers, John A.
Doctoral Committee Chair(s)
Rogers, John A.
Committee Member(s)
Lyding, Joseph W.
Li, Xiuling
Liu, Gang L.
Department of Study
Electrical & Computer Engineering
Discipline
Electrical & Computer Engineering
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Ultra-thin silicon
flexible and stretchable electronics
Abstract
In recent years, research in flexible electronic systems has increased due to its potential to create and manipulate new classes of applications (e.g., foldable and flexible display, flexible photovoltaic, epidermal electronics, and other systems) that can be integrated outside of conventional wafer-based electronics. With suitable choice of materials and design strategies, inorganic semiconductors (e.g., Si and GaAs) can be used on unconventional substrates for mechanical flexibility and high electrical performance. This dissertation presents the fabrication of mono-crystalline Si electronics by using top-down approaches. We describe five related topics of ultra-thin Si electronics which involve forming structures and assembling them by structured or non-structured elastomeric stamps or bulk wafer etching techniques. Furthermore, this dissertation demonstrates a strategy in which modules consist of large-scale arrays of interconnected high-performance ultra-thin Si electronics that are mechanically flexible, stretchable, and semitransparent, along with in-depth studies of their electrical and mechanical properties and applications.
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