Thin -Film Adhesion Measurement by Laser -Induced Stress Waves
Wang, Junlan
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https://hdl.handle.net/2142/87710
Description
Title
Thin -Film Adhesion Measurement by Laser -Induced Stress Waves
Author(s)
Wang, Junlan
Issue Date
2002
Doctoral Committee Chair(s)
Sottos, Nancy R.
Weaver, Richard L.
Department of Study
Theoretical and Applied Mechanics
Discipline
Theoretical and Applied Mechanics
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Engineering, Materials Science
Language
eng
Abstract
Based on the theoretical and experimental parametric study results, the planar tensile sample geometry is modified to a triangular prism so that a high strain rate shear wave is generated and then allowed to impinge upon the test film. By allowing the initial longitudinal wave to mode convert to a shear wave and a secondary longitudinal wave at the oblique surface, mixed-mode loading of the thin film interface is realized. Film failure under mixed-mode conditions is observed and the mixed-mode interfacial strength is measured and compared with the tensile case.
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