In-Situ Micro Testing Techniques for Electro-Thermo-Mechanical Characterization of Nano/micro-Scale Materials
Han, Jong Hee
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https://hdl.handle.net/2142/83884
Description
Title
In-Situ Micro Testing Techniques for Electro-Thermo-Mechanical Characterization of Nano/micro-Scale Materials
Author(s)
Han, Jong Hee
Issue Date
2007
Doctoral Committee Chair(s)
Saif, M. Taher A.
Department of Study
Mechanical Engineering
Discipline
Mechanical Engineering
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Engineering, Mechanical
Language
eng
Abstract
100-nm-thick Al films deposited at two different conditions and having different grain sizes were compared for their thermal behavior by in-situ TEM annealing. The sample having grain size of 250 nm showed grain growth while that with 55-nm grains displayed no grain growth up to melting. The difference is attributed to larger concentration of oxygen in the latter sample. However, when the film having 55-nm grain size was interfaced with a SiO 2 layer, grain growth was seen near the melting, possibly because of the increased stress induced from thermal mismatch. Also, 4-point electrical resistance measurement was performed on 100-nm thick Al film. Its temperature-dependent response was normal metallic linear behavior except that the initial resistivity was about 10 times higher than the bulk value.
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