Surface Reaction Mechanisms in Plasma Etching Processes
Zhang, Da
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Permalink
https://hdl.handle.net/2142/82937
Description
Title
Surface Reaction Mechanisms in Plasma Etching Processes
Author(s)
Zhang, Da
Issue Date
2000
Doctoral Committee Chair(s)
Kushner, Mark J.
Department of Study
Materials Science and Engineering
Discipline
Materials Science and Engineering
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Engineering, Chemical
Language
eng
Abstract
Surface reactions occurring in fluorocarbon plasmas also influence plasma properties by consuming or generating plasma fluxes. Of particular interest is the effect that surfaces have on CF2 densities, as CF2 is a precursor for polymer formation. These processes were investigated with the integrated plasma-surface model. Simulations demonstrated that CF 2 self-sticking is a loss at the surface, while ion sputtering and large ion dissociation can generate CF2 at surfaces. The net effect of the surface depends on the relative magnitudes of the loss and generation reactions.
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