Aluminum/titanium Nitride Metal/diffusion-Barrier Systems: Interfacial Reaction Paths and Kinetics as a Function of Microstructure and Texture
Chun, Jin-Sung
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https://hdl.handle.net/2142/82926
Description
Title
Aluminum/titanium Nitride Metal/diffusion-Barrier Systems: Interfacial Reaction Paths and Kinetics as a Function of Microstructure and Texture
Author(s)
Chun, Jin-Sung
Issue Date
2000
Doctoral Committee Chair(s)
Greene, J.E.
Department of Study
Materials Science and Engineering
Discipline
Materials Science and Engineering
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Engineering, Materials Science
Language
eng
Abstract
Based upon overall results, this research establishes that dense 111-textured Al/TiN bilayers exhibit much higher thermal stability than dense 002-textured A/TiN bilayers which are, in turn, more stable than the underdense Al/TiN bilayers currently used in industry. I have demonstrated that the primary reason for the enhancement in thermal stability is the higher structural quality of the interfacial reaction product AlN which serves as a blocking layer for further reactions. Therefore, optimizing the quality and structural integrity of the AlN layer through texture and microstructure control of the TiN diffusion barrier is key to enhancing the thermal stability of the Al/TiN interface.
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