Low-Temperature Chemical Vapor Depostion of Ruthenium and Manganese Nitride Thin Films
Lazarz, Teresa S.
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https://hdl.handle.net/2142/82859
Description
Title
Low-Temperature Chemical Vapor Depostion of Ruthenium and Manganese Nitride Thin Films
Author(s)
Lazarz, Teresa S.
Issue Date
2009
Doctoral Committee Chair(s)
Abelson, John R.
Department of Study
Materials Science and Engineering
Discipline
Materials Science and Engineering
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Physics, Condensed Matter
Language
eng
Abstract
Manganese nitride films were grown by chemical vapor deposition from the volatile manganese(II) amido precursor bis[di(tert)-butyl)amido]manganese(II)and ammonia. Between 80 and 200°C, the films grown from bis[di(tert )-butyl)amido]manganese(II)contain crystalline eta-Mn3N 2. At 300°C, a mixture of eta- and xi-phase manganese nitride with a manganese carbide impurity is deposited. Oxygen and carbon contamination in the bulk of the films is less than 1 atomic percent. Remarkably, the films are nearly completely crystalline at growth temperatures of 200°C and above. The growth rate of 5.9 nm/min at 200°C is also remarkably high for such a low growth temperature. The crystallinity and rapid growth rates are attributed to the labile metal-ligand bonding characteristic of high-spin MnII. As a result, reactive surface species remain mobile on the surface throughout much of the reaction pathway leading to nitride growth, and can settle into low-energy ordered arrangements before they become incorporated into the bulk by subsequent deposition activity.
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