Design of Novel High Temperature Thermosetting Resins Tailored to Specific Needs
Huang, Yongqing
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https://hdl.handle.net/2142/82774
Description
Title
Design of Novel High Temperature Thermosetting Resins Tailored to Specific Needs
Author(s)
Huang, Yongqing
Issue Date
2004
Doctoral Committee Chair(s)
Economy, James
Department of Study
Materials Science and Engineering
Discipline
Materials Science and Engineering
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Engineering, Materials Science
Language
eng
Abstract
ATSP was applied as a high temperature adhesive for copper foils in order to improve the performance and the reliability of microelectronic devices. Zn-coated Cu foil displayed significantly higher adhesion to ATSP than Cu foils and Ni-coated Cu foils. The improvement is due to the stronger mechanical interlocking effect and stronger chemical interaction at the interface. Failure mechanism of Zn-coated Cu foil with ATSP was both cohesive and adhesive. Only adhesive failure occurred at the ATSP/Cu and ATSP/Ni interface.
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