In Situ Infrared Spectroscopic Studies of Electrodeposition Additive Adsorption on Copper
Papapanayiotou, Demetrius
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https://hdl.handle.net/2142/82435
Description
Title
In Situ Infrared Spectroscopic Studies of Electrodeposition Additive Adsorption on Copper
Author(s)
Papapanayiotou, Demetrius
Issue Date
1997
Doctoral Committee Chair(s)
Alkire, Richard C.
Department of Study
Chemical Engineering
Discipline
Chemical Engineering
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Chemistry, Analytical
Language
eng
Abstract
CTA with bisulfate counterion promoted smooth electrodeposits. Secondary ion mass spectroscopy (SIMS) depth profiles indicated that CTA was not significantly incorporated into copper deposits grown in the presence of CTA with HSO$\sb4\sp-$ counterion, except at very high overpotentials ($>$500 mV). Depth profiles of deposits grown in the presence of thiourea showed incorporation of the thiourea predominantly as sulfur. Depth profiles of deposits grown in the presence of CTA with Br$\sp-$ at sufficiently large overpotentials for electrodeposition rates to be appreciable (about 500 mV) indicated incorporation of CTA and Br. Such deposits also showed very nonuniform morphologies.
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