Investigation of the Effects of Solution Additives on Nucleation and Growth During Copper Electrodeposition Onto Resistive Ruthenium Barrier Layers
Younker, Jennifer Lauren
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https://hdl.handle.net/2142/82419
Description
Title
Investigation of the Effects of Solution Additives on Nucleation and Growth During Copper Electrodeposition Onto Resistive Ruthenium Barrier Layers
Author(s)
Younker, Jennifer Lauren
Issue Date
2008
Doctoral Committee Chair(s)
Alkire, Richard C.
Department of Study
Chemical Engineering
Discipline
Chemical Engineering
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Engineering, Chemical
Language
eng
Abstract
This thesis describes the design and execution of experiments suitable for extracting quantitative information needed for numerical simulation of the effect of plating solution additives on copper nucleation on ruthenium films. This investigation contributes procedures for quantitative characterization of the effect of additives on early stages of copper electrodeposition on ruthenium substrates. Such procedures will enable improved engineering methods for prediction, design, control, and optimization of electrodeposition processes for growth of thin films on foreign substrates.
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