Multiscale Simulation and Optimization of Copper Electrodeposition
Li, Xiaohai
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Permalink
https://hdl.handle.net/2142/82396
Description
Title
Multiscale Simulation and Optimization of Copper Electrodeposition
Author(s)
Li, Xiaohai
Issue Date
2007
Doctoral Committee Chair(s)
Braatz, Richard D.
Alkire, Richard C.
Department of Study
Chemical Engineering
Discipline
Chemical Engineering
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Engineering, Chemical
Language
eng
Abstract
Two parallel KMC algorithms were also developed for the simulation of electrochemical nucleation and growth. Compared to the regular serial KMC algorithm, the developed parallel algorithms are able to speedup simulations and study large systems which may not be addressed by a single processor due to memory limitations.
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