Investigation of the Influence of a Model Additive System on Copper Electrodeposition: Integration of Experiments on the Surface Morphology Evolution With Multiscale Simulation
Xue, Feng
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https://hdl.handle.net/2142/82379
Description
Title
Investigation of the Influence of a Model Additive System on Copper Electrodeposition: Integration of Experiments on the Surface Morphology Evolution With Multiscale Simulation
Author(s)
Xue, Feng
Issue Date
2005
Doctoral Committee Chair(s)
Alkire, Richard C.
Department of Study
Chemical Engineering
Discipline
Chemical Engineering
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Engineering, Chemical
Language
eng
Abstract
In the last chapter, copper electroplating behavior on electrodeposited ruthenium surface was briefly discussed.
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