Multiscale Simulations of Nanofabricated Structures: Application to Copper Electrodeposition for Electronic Devices
Drews, Timothy Owen
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https://hdl.handle.net/2142/82363
Description
Title
Multiscale Simulations of Nanofabricated Structures: Application to Copper Electrodeposition for Electronic Devices
Author(s)
Drews, Timothy Owen
Issue Date
2004
Doctoral Committee Chair(s)
Alkire, Richard C.
Braatz, Richard D.
Department of Study
Chemical and Biomolecular Engineering
Discipline
Chemical and Biomolecular Engineering
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Engineering, Materials Science
Language
eng
Abstract
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