Design Automation for Reliable CMOS Chip Input/output Circuits
Li, Tong
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https://hdl.handle.net/2142/81930
Description
Title
Design Automation for Reliable CMOS Chip Input/output Circuits
Author(s)
Li, Tong
Issue Date
1998
Doctoral Committee Chair(s)
Kang, Sung-Mo (Steve)
Department of Study
Computer Science
Discipline
Computer Science
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Engineering, Electronics and Electrical
Language
eng
Abstract
Thermal failure is one of the most prevalent failure mechanism during the Human Body Model (HBM) ESD stress. Previous circuit thermal model (integrator circuit) in iETSIM only applies for constant current stress. A general thermal model using convolution is developed. New techniques are proposed to implement a thermal convolver, including regionwise-exponential (RWE) approximation and recursive convolution. The efficiency of the new thermal convolver makes it feasible to simulate a CMOS circuit containing many devices within a short time.
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