Models for Yield Estimation of Multichip Module Ceramic Substrates
Castano, Rebecca L.
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https://hdl.handle.net/2142/81220
Description
Title
Models for Yield Estimation of Multichip Module Ceramic Substrates
Author(s)
Castano, Rebecca L.
Issue Date
1998
Doctoral Committee Chair(s)
Seth Hutchinson
Department of Study
Electrical Engineering
Discipline
Electrical Engineering
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Engineering, Packaging
Language
eng
Abstract
We present improved yield models that can be used for a broader range of printed patterns. We also enhance the defect geometry models that are commonly used today. We introduce a defect geometry model that is based on the physical process of defect formation. Our defect geometry model employs Markov random fields to represent more general defect shapes. Yield is estimated using Monte Carlo sampling methods. Finally, we present methods for estimating the parameters of the yield models using observed data from the manufacturing process.
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