Finite Element Analysis of Multilayer Transmission Lines and Circuit Components
Mao, Kaiyu
This item is only available for download by members of the University of Illinois community. Students, faculty, and staff at the U of I may log in with your NetID and password to view the item. If you are trying to access an Illinois-restricted dissertation or thesis, you can request a copy through your library's Inter-Library Loan office or purchase a copy directly from ProQuest.
Permalink
https://hdl.handle.net/2142/81064
Description
Title
Finite Element Analysis of Multilayer Transmission Lines and Circuit Components
Author(s)
Mao, Kaiyu
Issue Date
2007
Doctoral Committee Chair(s)
Jian-Ming Jun
Department of Study
Electrical and Computer Engineering
Discipline
Electrical and Computer Engineering
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Engineering, Packaging
Language
eng
Abstract
The finite element method is applied to simulate frequency-domain electromagnetic behaviors of multilayer transmission lines and multilayer circuit components that are commonly used in microwave, RF circuits, integrated circuits, and electronic circuit packaging and interconnects. Some difficulties encountered in numerical simulations are tackled with special treatments. First, a generalized eigenvalue problem for inhomogeneous multilayer transmission lines is formulated with the full-wave finite element method. Computationally efficient solvers are employed to solve the eigenvalue problem, which make the fast full-wave field solution possible for hundreds of thousands or even millions of unknowns. Several issues in the simulation are discovered and discussed. Second, the full-wave field solution of transmission lines is used to extract distributed circuit parameters that are useful in circuit designs. A traditional 2-D quasi-TEM finite element method is also extended to handle anisotropic materials in the transmission line analysis. Third, the 3-D full-wave finite element method is applied to analyze circuit components on multilayer boards. The first-order absorbing boundary condition is used to truncate the simulation domain, and the eigenfunction expansion method is used to connect the circuit component to signal inputs and outputs. A new E-H type eigenfunction expansion formulation is used for inhomogeneous port boundary conditions. Various types of planar structures are calculated with the 3-D finite element method. Fourth, a domain decomposition algorithm is developed to reduce the computational efforts in the 3-D multilayer circuit component simulation. The domain decomposition algorithm is further accelerated by a new order-reduction method using modal field basis functions on intersubdomain surfaces and port surfaces. Examples show that the accelerated domain decomposition algorithm greatly improves the performance of the finite element simulation for large multilayer circuit problems. Last, conclusion and possible future research topics are discussed. General computer programs implementing the ideas of this dissertation have been written. Various types of structures are simulated and the results are verified to validate the formulations and their code implementations.
Use this login method if you
don't
have an
@illinois.edu
email address.
(Oops, I do have one)
IDEALS migrated to a new platform on June 23, 2022. If you created
your account prior to this date, you will have to reset your password
using the forgot-password link below.
