University of Illinois Urbana-Champaign

Evolution of surface waviness in thin films via volume and surface diffusion

Panat, Rahul Padmakar; Hsia, K. Jimmy; Cahill, David G.

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https://hdl.handle.net/2142/702

Description

Title
Evolution of surface waviness in thin films via volume and surface diffusion
Author(s)
  • Panat, Rahul Padmakar
  • Hsia, K. Jimmy
  • Cahill, David G.
Issue Date
2005
Keyword(s)
Surface diffusion
Abstract
Deformation mechanisms involving mass transport by stress driven diffusion influence a large number of technological problems. We study the formation of undulations on surfaces of stressed films at high temperature by exploring the deformation kinetics governed by volume and surface diffusion. A governing equation is derived that gives the amplitude change of such surfaces as a function of time. A parametric study is then carried out using a range of practically important input values of the film material properties. The results show that at the dominant instability wavelength, under high average stresses (giga pascal range), only surface diffusion contributes to film surface morphology evolution whereas under low stress and high-temperature conditions, both surface diffusion and volume diffusion contribute to film surface morphology evolution. Furthermore, the contribution of volume diffusion depends on the sign of the film stress, with compressive stress promoting surface roughening and tensile stress promoting surface smoothing.
Publisher
American Institute of Physics
Type of Resource
text
Language
en
Permalink
http://hdl.handle.net/2142/702
DOI
https://doi.org/10.1063/1.1827920
Copyright and License Information
Copyright 2005 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics.

Owning Collections

Published Papers - Theoretical and Applied Mechanics (TAM) PRIMARY
Papers published by faculty in Theoretical and Applied Mechanics