High Speed Impinging Jet Plating: Slot Jet and Through-Hole Plating
Ju, Jeh-Beck
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https://hdl.handle.net/2142/69745
Description
Title
High Speed Impinging Jet Plating: Slot Jet and Through-Hole Plating
Author(s)
Ju, Jeh-Beck
Issue Date
1984
Department of Study
Chemical Engineering
Discipline
Chemical Engineering
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Engineering, Chemical
Abstract
The characteristics of two different impinging jet plating systems was investigated in this study. The local mass transfer rates for slot jet system were measured with use of sectioned electrode technique and were compared with the other previous studies. Based on the measured mass transfer quantities, a theoretical model was solved to provide the design criteria of high speed selective slot jet plating system.
An applicability of an impinging circular jet as a through-hole plating system was examined. The local mass transfer rates and shear stresses along the wall of a hole were measured with several sectioned electrodes which simulate a hole in multilayer circuit board. The mass transfer correlations were presented in terms of various dimensionless parameters. From an analogy of theses measured quantities, the patterns of fluid flow field and mass transport inside a hole were identified to achieve the appropriate theoretical model. The flow pattern was considered as developing laminar flow rather than fully developed laminar flow.
Based on the measured shear stress quantities, a theoretical model was developed to predict the cell performance with various system parameters and compared with other models such as fully developed flow model and developing flow model. The model for the developing flow through the hole presented an edge effects at the entrance of the electrode. The characteristics of the system were examined with various dimensionless parameters and were found to give almost similar behavior of fully developed flow model.
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