Efficient Heat Extraction through Transfer Printed Diamond Heat Spreader
Won, Sang M.
This item is only available for download by members of the University of Illinois community. Students, faculty, and staff at the U of I may log in with your NetID and password to view the item. If you are trying to access an Illinois-restricted dissertation or thesis, you can request a copy through your library's Inter-Library Loan office or purchase a copy directly from ProQuest.
Permalink
https://hdl.handle.net/2142/47057
Description
Title
Efficient Heat Extraction through Transfer Printed Diamond Heat Spreader
Author(s)
Won, Sang M.
Contributor(s)
Rogers, John A.
Issue Date
2009-05
Keyword(s)
flexible electronics
stretchable electronics
materials integration
transfer printing
thermal management
Abstract
3-D heterogeneous integration (3DHGI) of different materials has great potential for electronic applications such as flexible and stretchable circuits, and multilayer solar cells. Here, we demonstrate heterogeneous integration of ultrananocrystalline diamond (UNCD) with silicon using transfer-printing. Using this approach we demonstrate dramatically improved heat extraction from the silicon layer. This 3D heterogeneously integrated system can offer superior thermal management for high power electronics such as GaN HEMT-based power amplifiers.
Use this login method if you
don't
have an
@illinois.edu
email address.
(Oops, I do have one)
IDEALS migrated to a new platform on June 23, 2022. If you created
your account prior to this date, you will have to reset your password
using the forgot-password link below.