Materials, device designs, and integration approaches for transient, bio-resorbable silicon electronic systems

Hwang, SukWon

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https://hdl.handle.net/2142/45581 Copy

Description

Title

Materials, device designs, and integration approaches for transient, bio-resorbable silicon electronic systems

Author(s)

Hwang, SukWon

Issue Date

2013-08-22T16:48:32Z

Director of Research (if dissertation) or Advisor (if thesis)

Rogers, John A.

Doctoral Committee Chair(s)

Rogers, John A.

Committee Member(s)

• Braun, Paul V.
• Cheng, Jianjun
• Li, Xiuling

Department of Study

Materials Science & Engineerng

Discipline

Materials Science & Engr

Degree Granting Institution

University of Illinois at Urbana-Champaign

Degree Name

Ph.D.

Degree Level

Dissertation

Keyword(s)

• transient electronics
• bioresorbable device
• biocompatible
• silicon dissolution

Abstract

A remarkable feature of a silicon-based electronics is its capability to operate functionally and physically invariant for many practical purposes. Here, we introduce a technology that offers the opposite behavior: it gradually vanishes over time, in a well-controlled, programmed manner. Devices that are ‘transient’ in this sense have potential applications that cannot be addressed with conventional electronic devices, such as implantable biomedical devices that remain for medically useful time periods, but then completely dissolve/resorb into the body. We report a set of materials, manufacturing schemes, device components and theoretical design tools for a silicon-based complementary metal oxide semiconductor (CMOS) technology and power scavenging system with oscillators as a building block of wireless communication, which has this type of ‘transient’ behavior, together with various integrated sensors. A transient silicon device capable of delivering thermal therapy in an implantable mode and its demonstration in animal models illustrate a system-level example of this technology. Another discovery for this type of transient electronics is materials and fabrication procedures that the key device processing steps occur on silicon wafer substrates, in schemes compatible with established methods used in conventional microelectronics. The approach relies on an unusual type of silicon on insulator wafer, and yields devices that use ultrathin sheets of monocrystalline silicon for the semiconductor, thin films of magnesium for the electrodes and interconnects, silicon dioxide and magnesium oxide for the dielectrics and silk for the substrates. A range of component examples, with detailed measurements of their electrical characteristics and dissolution properties, illustrate the capabilities. In vivo toxicity tests demonstrate biocompatibility in sub-dermal implants. The results have significance for broad classes of water-soluble, ‘transient’ electronic devices.

Graduation Semester

2013-08

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http://hdl.handle.net/2142/45581

Copyright and License Information

Copyright 2013 SukWon Hwang

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