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https://hdl.handle.net/2142/45905
Description
Title
A Compact Thermal Model for Phase Change Memory
Author(s)
Wahby, William
Contributor(s)
Pop, Eric
Issue Date
2007-12
Keyword(s)
phase-change memory
thermal modeling
thermal simulation
device thermal behavior
Abstract
Phase change memory (PCM) is a novel nonvolatile memory technology with great potential for scaling beyond the physical limits of Flash, at dimensions of 35 nm and below. Rather than relying on charge storage, PCM functions based on the reversible change in resistivity of certain glassy materials (chalcogenides), which can be thermally actuated by Joule heating. The operation of PCM devices, however, is difficult to model, as complex electro-thermal interactions govern the device behavior. The aim of this work is to present a simple analytical model which can reproduce the thermal behavior of an isolated PCM cell with a minimum of physical parameters and computational complexity. Finite element simulations are also carried out for comparison against the compact model, and the various models are used to investigate the effect of thermal interfacial resistance on the device behavior.
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