University of Illinois Urbana-Champaign

Interfacial cracks between piezoelectric and elastic materials under in-plane electric loading

Liu, Ming; Hsia, K. Jimmy

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https://hdl.handle.net/2142/268

Description

Title
Interfacial cracks between piezoelectric and elastic materials under in-plane electric loading
Author(s)
  • Liu, Ming
  • Hsia, K. Jimmy
Issue Date
2001-12
Keyword(s)
  • experimental solid mechanics
  • fracture
  • micromechanics
  • plasticity
Abstract
Evaluation of crack tip driving force for interfacial cracks between piezoelectric actuators and elastic substrates is crucial to successful applications of smart materials and smart structures. Here the behavior of an interfacial crack between a piezoelectric material and an elastic material in under in-plane loading is studies. The displacement mismatch along a bonded interface due to electric potential loading on the piezoelectric material is modeled by an array of uniformly distributed dislocations along the interface. Using Fourier transformation method, the governing equations are converted to an integral equation, which is then converted to a standard Hilbert problem. A closed form solution for stresses, electric field, and electric displacements along the bonded interface is obtained. The results agree very well with that from numerical simulations using the finite element method. The results show that the closed form solution is not only accurate for far field distributions of stresses and electric variables, but also accurate for the asymptotic distributions near the crack tip. The solution also suggests the likelihood of domain switch in the piezoelectric material near the crack tip.
Publisher
Department of Theoretical and Applied Mechanics (UIUC)
Series/Report Name or Number
TAM Reports 992
ISSN
0073-5264
Type of Resource
text
Language
en
Permalink
http://hdl.handle.net/2142/268

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Technical Reports - Theoretical and Applied Mechanics (TAM) PRIMARY
TAM technical reports include manuscripts intended for publication, theses judged to have general interest, notes prepared for short courses, symposia compiled from outstanding undergraduate projects, and reports prepared for research-sponsoring agencies.