Interfacial physics in meniscus-confined electrodeposition and its applications for fabricating electronic structures
Hu, Jie
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https://hdl.handle.net/2142/24476
Description
Title
Interfacial physics in meniscus-confined electrodeposition and its applications for fabricating electronic structures
Author(s)
Hu, Jie
Issue Date
2011-05-25T14:24:24Z
Director of Research (if dissertation) or Advisor (if thesis)
Yu, Min-Feng
Doctoral Committee Chair(s)
Yu, Min-Feng
Committee Member(s)
Ferreira, Placid M.
King, William P.
Kim, Kyekyoon
Department of Study
Mechanical Sci & Engineering
Discipline
Mechanical Engineering
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Meniscus-confined Electrodeposition
Nanoprobes
Wire Bonding
3-D Structures
Abstract
A novel three-dimensional micro-/nano-fabrication method, the meniscus-confined electrodeposition, was developed and studied. It exploits the thermodynamic stability of a microscale or nanoscale liquid meniscus to direct-write pure metallic three-dimensional structures of designed shapes and sizes in an ambient air environment. This technique is cost-effective to implement and is based on the principle of electrodeposition, and can thus be applied to fabricate structures made of a wide variety of materials. In this work, theoretically, a detailed analysis was provided for describing the growth parameters essential for the meniscus-confined electrodeposition process; experimentally, various techniques were developed to fabricate structures with demanding shapes and dimensions for specific electrical and electrochemical applications.
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