University of Illinois Urbana-Champaign

Growth and characterization of metal/polymer interfaces

Sengupta, Kabul Sushil

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Description

Title
Growth and characterization of metal/polymer interfaces
Author(s)
Sengupta, Kabul Sushil
Issue Date
1991
Doctoral Committee Chair(s)
Birnbaum, Howard K.
Department of Study
  • Chemistry, Analytical
  • Engineering, Metallurgy
  • Engineering, Materials Science
Discipline
  • Chemistry, Analytical
  • Engineering, Metallurgy
  • Engineering, Materials Science
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
  • Chemistry, Analytical
  • Engineering, Metallurgy
  • Engineering, Materials Science
Language
eng
Abstract
  • A number of metal/polyimide interfaces such as Ti, Al, and Ni/Polyimide systems were studied to determine their chemistry, structure, and stability in various environments.
  • The Au/Cu/Ti/Polyimide (sputtered) system delaminated in a hydrogen environment at elevated temperatures. The delaminated planes were characterized and the failure loci were found to be at the Ti-Polyimide interdiffusion zone/polyimide interface. Precipitation of titanium hydride during anneals in hydrogen atmospheres caused large interfacial stresses which lead to failure. No delamination was observed when the metallization was done on an unsputtered polyimide substrate.
  • The effects of ion bombardment on the structure and chemistry of the polyimide were studied using X-ray Photoelectron Spectroscopy. The surface chemistry of the polyimide was severely altered by the ion bombardment. In addition to a decrease in the oxygen concentration (particularly from the carbonyl) and amorphous carbon formation due to dehydrogenation and bond scission, a net negative surface charge was found due to unbonded anions created on the surface.
  • Aluminum and nickel were deposited in situ in the X-ray Photoelectron Spectrometer on the polyimide and the chemistry of the developing interface was studied as a function of metal film thickness. Aluminum was found to interact with the carbonyl group by charge transfer followed by Al-O-C formation. The chemical interaction of nickel was limited to a thermally reversible charge transfer process with PMDA, carbonyl and the ODA groups. Unlike aluminum, nickel diffused into the polyimide at 600 K. Both metals exhibit island or Volmer-Weber type of growth on the polyimide.
Type of Resource
text
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http://hdl.handle.net/2142/23698
Copyright and License Information
Copyright 1991 Sengupta, Kabul Sushil

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