iSMILE: An integrated system for device model design, parameter extraction, and circuit simulation
Yang, Andrew Tien
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Permalink
https://hdl.handle.net/2142/22982
Description
Title
iSMILE: An integrated system for device model design, parameter extraction, and circuit simulation
Author(s)
Yang, Andrew Tien
Issue Date
1989
Department of Study
Electrical Engineering
Discipline
Electrical Engineering
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
Ph.D.
Degree Level
Dissertation
Keyword(s)
Engineering, Electronics and Electrical
Language
eng
Abstract
An important bottleneck faced in the use of CAD tools such as a circuit simulator and a parameter extractor to explore new device technology lies in the time-consuming process of developing and verifying new models. In this thesis, a novel CAD system which integrates device model design, circuit simulation, and parameter extraction into one design environment is presented. Users are completely shielded from the internal complexity of the program and hence no program modification is required to implement new models. This thesis focuses on novel design methodology and algorithms for integrating model development, circuit simulation, and parameter extraction in detail.
The superior transmission characteristics of optical interconnects have motivated active research aimed at applying new photonic techniques at various levels within a computing architecture. For performance evaluation and a shortening of the turn-around time in the design of optoelectronic integrated circuits (OEIC), computer-aided simulation of OEIC is indispensable. This thesis also discusses how iSMILE has been used for the development of new models for a GaAs HEMT, a multiple quantum well laser, a waveguide, and a lossy transmission line. Based on these models, the capability to simulate an optical interconnect line in an integrated fashion has been demonstrated. Several important issues of comparison between a metallic interconnect and an optical interconnect are projected for future applications.
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