Numerical Modeling of Multi-Conductor Interconnects for High Speed Integrated Circuits
Sheikh, Zuhaib B.
Loading…
Permalink
https://hdl.handle.net/2142/18390
Description
Title
Numerical Modeling of Multi-Conductor Interconnects for High Speed Integrated Circuits
Author(s)
Sheikh, Zuhaib B.
Issue Date
2011-01-14T22:48:52Z
Director of Research (if dissertation) or Advisor (if thesis)
Cangellaris, Andreas C.
Department of Study
Electrical & Computer Eng
Discipline
Electrical & Computer Engr
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
M.S.
Degree Level
Thesis
Keyword(s)
Transmission Line Model
Multi-conductor Interconnects
Two-dimensional RLCG extractor
Rational Fitting Algorithm
VECTFIT
HSPICE
Abstract
Presented here is an alternative methodology to the development of transmission line models for multi-conductor interconnects in high speed integrated circuits. The methodology starts with the assumption that per unit length (p.u.l.) transmission line parameters — i.e. p.u.l. resistance R, inductance L, capacitance C, and conductance G — have been extracted using a two-dimensional RLCG extractor. The methodology relies upon a rational fitting algorithm called VECTFIT to express the parameters as a rational function expression, a form suitable for equivalent circuit generation using a commercial circuit simulator like HSPICE. The methodology has been numerically verified and implemented in the form of some select interconnecting scenarios for typical on-chip applications. The new methodology has also been compared with the previous methodology for robustness, accuracy and computational efficacy.
Use this login method if you
don't
have an
@illinois.edu
email address.
(Oops, I do have one)
IDEALS migrated to a new platform on June 23, 2022. If you created
your account prior to this date, you will have to reset your password
using the forgot-password link below.
