Design of device-integrated heat sinks for liquid immersion cooling applications

Aflatounian, Shayan

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https://hdl.handle.net/2142/124266 Copy

Description

Title

Design of device-integrated heat sinks for liquid immersion cooling applications

Author(s)

Aflatounian, Shayan

Issue Date

2024-04-30

Director of Research (if dissertation) or Advisor (if thesis)

Miljkovic, Nenad

Department of Study

Mechanical Sci & Engineering

Discipline

Mechanical Engineering

Degree Granting Institution

University of Illinois at Urbana-Champaign

Degree Name

M.S.

Degree Level

Thesis

Keyword(s)

• Thermal Management
• Immersion Cooling
• Optimal Heat Sink Designs
• Dielectric Fluids

Abstract

This thesis investigates the thermal management of electronic devices through immersion cooling, focusing on optimizing heat transfer efficiency in various coolant mediums. Rising power densities in electronics demand effective cooling solutions to mitigate temperature-related performance issues. Immersion cooling, particularly using dielectric fluids, emerges as a promising approach. The study analyzes heat transfer behavior in coolants such as air, water, ethylene glycol (WEG 52%), and Novec 7300, identifying optimal heat sink designs through mathematical modeling and simulation. Water exhibits superior heat transfer performance but poses electrical conductivity risks. WEG 52% and Novec 7300 offer safer alternatives, with Novec 7300 being compatible with fabrication processes. Practical considerations dictate coolant selection based on electrical safety, cost, and implementation ease. Water remains most effective, but insulation is required. Alternatively, Novec 7300 provides a safer option for real-time applications. This study offers insights into electronic device thermal management and provides guidelines for designing efficient immersion cooling systems tailored to specific needs, paving the way for future research in optimizing coolant selection and heat sink designs.

Graduation Semester

2024-05

Type of Resource

Thesis

Copyright and License Information

Copyright 2024 Shayan Aflatounian

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