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https://hdl.handle.net/2142/120574
Description
Title
Subsurface 3D integrated photonic devices
Author(s)
Huang, Jack
Issue Date
2023-05-01
Director of Research (if dissertation) or Advisor (if thesis)
Goddard, Lynford L
Department of Study
Electrical & Computer Eng
Discipline
Electrical & Computer Engr
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
M.S.
Degree Level
Thesis
Keyword(s)
Integrated Photonics
Photonics Integrated Circuits
Mach-Zehnder Interferometers
Microring Resonators
Two-photon Lithography
Abstract
In recent years, there has been tremendous interest in photonic integrated circuits (PICs) for various applications such as communications, computing, and sensing. However, much of the existing works leverage traditional planar silicon photonics with limited integration density. In principle, volumetric photonic integrated circuits (VPICs) based on two-photon polymerization (TPP) enable the ability to massively integrate micron scale photonic elements within the volume of a substrate wafer, as opposed to traditional planar silicon photonics. To this end, we demonstrate the ability to fabricate high performing passive photonic devices - Mach-Zehnder interferometers and microring resonators. In particular, we will discuss the physical theory and engineering aspects of these two VPIC devices, as well as their fabrication and testing results.
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