Moving cohesive interface model for fracture in creeping material
Carranza, Fernando L.; Fang, Biao; Haber, Robert B.
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https://hdl.handle.net/2142/112538
Description
Title
Moving cohesive interface model for fracture in creeping material
Author(s)
Carranza, Fernando L.
Fang, Biao
Haber, Robert B.
Issue Date
1996-11
Keyword(s)
Cohesive Interface Model
Fracture
Creeping Materials
Abstract
We present a new cohesive interface model for quasi-static creep crack growth that is implemented within a moving-grid finite element model. A pseudo crack tip separates the coheisve process zone from the free surfaces of the crack. The moving-grid formulation models continous crack advance by describing relative motion between the pseudo crack tip and the material. This eliminates the need for extensive mesh refinement away from the current crack-tip location and supports both transient and direct steady-state solutions. A traction-separation law determines the energetic properties of the decohesion process and generates a simple criterion for crack advance. The new formulation remedies a problem in earlier models which permit a crack to heal on unloading. Numerical examples demonstrate the moving cohesive interface model in studies of steady-state crack growth. Adaptive grid refinement is used to control the accuracy of the solution.
Publisher
Department of Theoretical and Applied Mechanics. College of Engineering. University of Illinois at Urbana-Champaign
Series/Report Name or Number
TAM R 837
1996-6024
ISSN
0073-5264
Type of Resource
text
Language
eng
Permalink
http://hdl.handle.net/2142/112538
Sponsor(s)/Grant Number(s)
National Aeronautics & Space Administration 96/11 NGT 70374 96/11
Copyright and License Information
Copyright 1996 Board of Trustees of the University of Illinois
TAM technical reports include manuscripts intended for publication, theses judged to have general interest, notes prepared for short courses, symposia compiled from outstanding undergraduate projects, and reports prepared for research-sponsoring agencies.
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