University of Illinois Urbana-Champaign

Dislocation substructure in strain cycled copper as influenced by temperature

Pratt, J.E.

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https://hdl.handle.net/2142/112370

Description

Title
Dislocation substructure in strain cycled copper as influenced by temperature
Author(s)
Pratt, J.E.
Issue Date
1966-03
Keyword(s)
  • Copper
  • Strain-cycled Copper
  • Polycrystalline Copper
Abstract
Polycrystalline copper was cyclically deformed at various strain ranges and temperatures. The resulting dislocation substructure was examined by means of transmission electron microscopy, and a quantitative relationship between saturation flow stress and mean substructure size was found. A comparison of these results was made with other dislocation substructure and density measurements for copper and aluminum.
Publisher
Department of Theoretical and Applied Mechanics. College of Engineering. University of Illinois at Urbana-Champaign
Series/Report Name or Number
  • TAM R 663
  • 1971-8613
ISSN
0073-5264
Type of Resource
text
Language
eng
Permalink
http://hdl.handle.net/2142/112370
Sponsor(s)/Grant Number(s)
Air Force Materials Lab Wright Patterson AFB Ohio 66/03
Copyright and License Information
Copyright 1966 Board of Trustees of the University of Illinois

Owning Collections

Technical Reports - Theoretical and Applied Mechanics (TAM) PRIMARY
TAM technical reports include manuscripts intended for publication, theses judged to have general interest, notes prepared for short courses, symposia compiled from outstanding undergraduate projects, and reports prepared for research-sponsoring agencies.