University of Illinois Urbana-Champaign

Elasto plastic analysis of peel test

Kim, Kyung-Suk

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https://hdl.handle.net/2142/112212

Description

Title
Elasto plastic analysis of peel test
Author(s)
Kim, Kyung-Suk
Issue Date
1985-03
Keyword(s)
  • Peel Test
  • Elasto Plasto Analysis
Abstract
In the first year (1984) study of this project (Project #: IBM Peel Test, UI account #1-5-37119), an analytic method has been developed to analyze the elasto-plastic deformation of thin films in peeling process. With the analytic method, we could extract the adhesion bond energy from the peel-test values of thin (1 μm ~ 1 mm) metallic films. The validity of the analysis was verified by numerical and experimental analysis. The experimental analysis has been carried out by Dr. J. I. Kim of IBM independently. These studies extended the applicability of peel test from elastic peeling to elasto-plastic peeling. In particular, the analytic result strongly supports the validity of peel test with large amount of ductility (plasticity) that is inevitable in peel test of thin metallic films with strong adhesion. In particular, universal peel diagram is invented in this study. On the single universal peel diagram, interrelations of peel strength and adhesion energy can be readily read for all combinations of the material properties and the geometry (thickness of the adherend) of the specimen. In addition, the peel strength can be easily converted to pull strength using this diagram. The theory and the analytic results agree excellently with experimental results. (The experimental information was provided by Drs. L. Lee, P. Geldermans and J. Kim of IBM.)
Publisher
Department of Theoretical and Applied Mechanics. College of Engineering. University of Illinois at Urbana-Champaign
Series/Report Name or Number
  • TAM R 472
  • 1985-6003
ISSN
0073-5264
Type of Resource
text
Language
eng
Permalink
http://hdl.handle.net/2142/112212
Sponsor(s)/Grant Number(s)
IBM Corp 85/03 IBM PEEL TEST 44 1614 85/03
Copyright and License Information
Copyright 1985 Board of Trustees of the University of Illinois

Owning Collections

Technical Reports - Theoretical and Applied Mechanics (TAM) PRIMARY
TAM technical reports include manuscripts intended for publication, theses judged to have general interest, notes prepared for short courses, symposia compiled from outstanding undergraduate projects, and reports prepared for research-sponsoring agencies.