University of Illinois Urbana-Champaign

Measurement of change of thickness for thin plate by holographic; interferometry

Hu, Ching-Piao

Permalink

https://hdl.handle.net/2142/112126

Description

Title
Measurement of change of thickness for thin plate by holographic; interferometry
Author(s)
Hu, Ching-Piao
Issue Date
1974-09
Keyword(s)
  • Thickness
  • Thin Plate
  • Holographic Interferometry
  • Holo-moire Technique
  • Moire
  • Isopachic Fringes
Abstract
A holo-moire technique capable of compensating for rigid body motion for plane stress problem and providing a full-field isopachic fringe pattern is described. This technique combines holographic interferometry and the moire effect. Double exposure holograms are made from both sides of an object before and after deformation. The two sets of holographic interferometric fringes thus obtained are treated as random grids. Moire of these two grids yields the desired isopachic fringes. The theory is experimentally confirmed with several examples. Limitations of this technique are also discussed.
Publisher
Department of Theoretical and Applied Mechanics. College of Engineering. University of Illinois at Urbana-Champaign
Series/Report Name or Number
  • TAM R 395
  • 1974-6017
ISSN
0073-5264
Type of Resource
text
Language
eng
Permalink
http://hdl.handle.net/2142/112126
Sponsor(s)/Grant Number(s)
National Science Foundation, Grant NSF GK 25076, 74/09
Copyright and License Information
Copyright 1974 Board of Trustees of the University of Illinois

Owning Collections

Technical Reports - Theoretical and Applied Mechanics (TAM) PRIMARY
TAM technical reports include manuscripts intended for publication, theses judged to have general interest, notes prepared for short courses, symposia compiled from outstanding undergraduate projects, and reports prepared for research-sponsoring agencies.