This work reports a three-dimensional (3D) microwave L-C filter network enabled by a CMOS-compatible two-dimensional (2D) fabrication approach, which combines inductive (L) and capacitive (C) self-rolled-up membrane (S-RuM) components monolithically into a single L-C network structure, thereby greatly reducing the on-chip area footprint. The individual L-C elements are fabricated in-plane using standard semiconductor processing techniques, and subsequently triggered by the built-in stress to self-assemble and roll into cylindrical air-core architectures. By designing the planar structure geometry and constituent layer properties to achieve a specific number of turns with a desired inner diameter when the device is rolled up, the electrical characteristics can be engineered. The network layouts of the L and C components are also reconfigurable by selecting appropriate input, output, and ground contact routing topographies. The devices demonstrated here operate over the range of ~1-10 GHz. Their area and volume footprints are 0.095 mm2 and 0.01 mm3, respectively, which are ~10× smaller than most of the comparable conventional filter designs. These S-RuM-enabled 3D microtubular L-C filter networks represent a significant advancement for miniaturization and integration of RF devices for applications in mobile connectivity.
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