Simultaneous packing and routing optimization of thermal-fluid systems
Jessee, Alexander
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https://hdl.handle.net/2142/105691
Description
Title
Simultaneous packing and routing optimization of thermal-fluid systems
Author(s)
Jessee, Alexander
Issue Date
2019-07-15
Director of Research (if dissertation) or Advisor (if thesis)
James, Kai
Department of Study
Aerospace Engineering
Discipline
Aerospace Engineering
Degree Granting Institution
University of Illinois at Urbana-Champaign
Degree Name
M.S.
Degree Level
Thesis
Keyword(s)
optimization
routing
packing
system layout
Abstract
This study investigates the computational design of thermo-mechanical systems. The optimization simultaneously finds the best placement of devices as well as placement and size of routing segments. The layout must satisfy geometric constraints to avoid interference between components. Constraints based on physics models are also included. Physics constraints are important to designing a system feasible for real world use, but are often overlooked in current methods for routing optimization. A thermal conduction finite element model based on geometric projection is presented. Pressure drop of the fluid in the routing is modeled with a lumped parameter pipe flow model. A parameterization is developed that allows the use of gradient based optimization methods. Analytical sensitivities of the physics models and geometric constraints with respect to the parameterization are derived. A simple system is optimized using three different objective functions resulting in three significantly different layouts, demonstrating the importance of including physics in the optimization problem.
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