University of Illinois Urbana-Champaign

Lumped equivalent-circuit modeling of transmission lines on microchip silicon substrate

Shah, Milan

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https://hdl.handle.net/2142/105412

Description

Title
Lumped equivalent-circuit modeling of transmission lines on microchip silicon substrate
Author(s)
Shah, Milan
Contributor(s)
Zhou, Jin
Issue Date
2018-12
Keyword(s)
  • Microstrip
  • Transmission Line
  • Modeling
  • Equivalent Circuits
  • Electromagnetic Simulation
  • RLGC Parameters
  • S Parameters
  • Interconnect
Abstract
Interconnect is a fundamental component required in any integrated circuit design. For specific applications, or at high enough frequencies, it is necessary to model interconnect as a transmission line. However, not all circuit simulators support the use of transmission lines in the design space, creating a need for effective lumped element models for transmission lines. This thesis examines different lumped element models derived for interconnect transmission lines. The models are composed from the RLGC parameters extracted from an electromagnetic simulation, and the resulting equivalent circuit is analyzed. It is ultimately shown that, of the models observed, an empirical model produces the behavior most similar to the electromagnetic simulation.
Type of Resource
text
Language
en
Permalink
http://hdl.handle.net/2142/105412

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