University of Illinois Urbana-Champaign

Long-term conductively coupled silicon bioelectronics encapsulation using P++ nanomembranes

Zhong, Yishan

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https://hdl.handle.net/2142/104055

Description

Title
Long-term conductively coupled silicon bioelectronics encapsulation using P++ nanomembranes
Author(s)
Zhong, Yishan
Contributor(s)
Rogers, John A.
Issue Date
2019-05
Keyword(s)
  • bioelectronics
  • encapsulation
  • flexible electronics
  • biomedical implant
  • silicon electronics
Abstract
Chronic and long-term stable silicon bioelectronics open the possibility for direct integration of biological systems and devices that can be fabricated using conventional semiconductor foundries. We propose a novel encapsulation method that consists of a highly doped p++ nanomembrane and a thermally grown silicon dioxide layer. The structure formed is both a reliable biofluidic barrier and a conductively sensing interface. A soak test in high temperature highlights the structure’s effective elongation on the lifetime of the electronics.
Type of Resource
text
Language
en
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http://hdl.handle.net/2142/104055

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